7.
Lead in high melting temperature type solders (i.e. tin-lead
solder alloys containing more than 85% lead).
For the purposes of applications 7, 8 and 9 in this Annex,
it is useful to clarify the term ‘solder’. In
these Guidance Notes, ‘solder’ is defined as “alloys
used to create metallurgical bonds between two or more metal
surfaces to achieve an
electrical and/or physical connection”. In this context,
the term ‘solder’ also includes all materials
that become part of the final solder joint, including solder
finishes on components or printed circuit boards.
The high melting temperature type solder exemption has been
introduced to allow the use of lead in solders for specific
applications (such as in chip manufacturing), for which viable
lead-free alternatives have not yet been
identified. The high electrical conductivity and unique mechanical
properties of such a high melting point tin-lead alloy make
the material malleable and better able to withstand both temperature
and physical stress. Such properties ensure fewer defects
during manufacturing and high reliability throughout the life
of the component, thereby also resulting in fewer components
going into the waste
stream.
Since these high melting temperature solders are used in
combination with lower melting temperature solders to complete
a viable electrical connection (i.e. to properly connect the
chip to the semiconductor package), it has been proposed that
any lower melting temperature solder required to be used in
conjunction with high melting temperature solder should also
be considered to fall under this exemption. An assessment
of this proposal is included in the review of existing and
possible additional exemptions being undertaken by the European
Commission and mentioned in the Exemptions section of these
Guidance Notes.
Lead in solders for servers, storage and storage
array systems (exemption granted until 2010).
See definition of ‘solder’ given for application
7 above.
This exemption has been introduced to allow the use of lead
in solders for high reliability applications, such as servers,
for which viable lead-free alternatives have not yet been
identified.
In this context, a ‘server’ is seen as a computer
that meets one of the technology criteria that are set out
in section (a) below, and the functional criteria set out
in section (b) below.
(a) Technology criteria for a server
1) Designed and placed on the market as a Class A product
as per EN55022:1994 under the EMC Directive 89/336/EEC (intended
primarily for use in the professional environment) and designed
and capable of having a single or dual processor capability
(one or more sockets on board); or
2) Designed and placed on the market as a Class B product
(intended primarily for use in the domestic environment) as
per EN55022:1994 under the EMC Directive 89/336/EEC and designed
and capable of having at least dual processor capability (two
sockets on board).
(b) Functional design criteria for a server
1) Designed and capable of operating in a mission-critical,
high-reliability, highavailability application in which use
may be 24 hours per day and 7 days per week, and unscheduled
downtime is extremely low (minutes per year).
Examples of typical server functions are the provision of
network infrastructure, gateway or switching services, the
hosting and management of data on behalf of multiple users,
or the running of server-capable operating systems (e.g. as
for a web server). This exemption is viewed as applying to
the whole of the computer and its components including processors,
memory boards, power converters, power supplies, enclosed
housings, modular power subsystems and adapter cards. It would
also seem to apply to the components that are integrated into
the whole computer or that are sold separately for use in
an exempt server. Cables and cable assemblies, and all connectors
and connector assemblies used to provide interconnections
for the server, would also be covered.
It should be noted that this exemption is not viewed as applying
to parts or components that are peripheral to the server,
nor does it apply to parts or components when they are used
other than in an exempt server.
For the purpose of the RoHS Regulations, a ‘storage
or storage array system’ is viewed as any storage device
or subsystem that meets one of the following criteria:
1) Designed and placed on the market as a Class A product
as per EN55022:1994 under the EMC Directive 89/336/EEC; or
2) Designed and placed on the market as a Class B product
as per EN55022:1994 under the EMC Directive 89/336/EEC and
designed to meet one of the following two criteria: -
a) Any storage device capable of accepting direct or switched
input from more than one computer, for example fibre channel
and SCSI devices, or
b) Any storage fabric or switching device for interconnecting
storage devices to server products.
The exemption is viewed as applying to the whole of the device
or subsystem. It should be noted that this exemption does
not apply to parts or components that are peripheral to the
storage or storage array system, nor does it apply to parts
or components when they are used other than in an exempt storage
or storage array system.
Lead in solders for network infrastructure equipment
for switching, signaling, transmission as well as network
management for telecommunication.
See definition of ‘solder’ given for application
7 above.
This exemption has been introduced to allow the use of lead
in solders for high reliability applications, such as network
infrastructure equipment, for which viable lead-free alternatives
have not yet been identified. In this context network infrastructure
equipment for telecommunication purposes is viewed as equipment
meeting one or more of the following criteria:
1) Any system used for routing, switching, signalling, transmission,
or network management or network security;
2) Any system which can simultaneously enable more than one
end user terminating equipment to connect to a network;
3) Any system in a network except for end user terminating
equipment such as voice terminals and facsimile machines.
This would appear to include all components, power suppliers,
display devices and similar electronic units that are incorporated
into network infrastructure equipment. It would also include
all cables and cable assemblies, and all
connectors and connector assemblies used to provide interconnections
for network infrastructure equipment.
Lead in electronic ceramic parts (e.g. piezoelectronic
devices). Ceramic materials are used in a variety
of electronic devices including capacitors, insulators, piezoelectrics,
magnets and integrated circuit packages. Some of these ceramic
materials contain lead, for example lead zirconate titanate
and lead magnesium niobate. The specific chemical composition
and manufacturing process of these materials determine their
electrical parameters, such as dielectric constant and the
dissipation, that is essential for the functioning of the
component in which they are used. Hence, lead used in the
ceramic parts of components in electrical and electronic equipment
is exempt from these
Regulations.
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